Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability

Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a wide service temperature range of 4K to 250ºF. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75ºF. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.