Flexibilized and Toughened Adhesive Systems
Master Bond has developed the widest variety of flexibilized and toughened epoxies, silicones, polyurethanes, polysulfides and UV curables for special application requirements. These compounds are designed for high performance even in hostile environmental conditions and are serviceable at low to high temperatures.
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Features of Master Bond's Flexibilized and Toughened Adhesive Systems
Master Bond's flexibilized and toughened adhesives, sealants and coatings are presently employed in applications ranging from design and production to repair, maintenance and field service. Specific grades offer:
- Excellent electrical insulation and chemical resistance properties
- Electrical and thermal conductivity
- NASA low outgassing approval
- Superior thermal shock, impact and stress cracking fatigue resistance
- Optical clarity
- Outstanding adhesion to dissimilar substrates
Our Most Popular Flexibilized and Toughened Epoxy Compounds
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B-staged film adhesive/sealant. Outstanding thermal cycling capabilities and structural properties. Offers superior toughness and flexibility. Excellent strength retention at elevated temperatures. Thermally conductive/electrically insulative. Provides uniform bond line thickness. Serviceable from -100°F to +500°F. Preforms are available.
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Two part, room temperature curing epoxy with outstanding flexibility and superb adhesion to many rubbers and metals. Excellent thermal cycling properties. Ability to withstand mechanical shock and vibration. T-peel strength 25-35 pli. Elongation >200%. Water and chemical resistant. Operating temperature range -100°F to +250°F.
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Single component toughened epoxy adhesive with good flow properties. Resistant to thermal cycling, mechanical vibration/shock. Tensile lap shear strength 2,800-3,000 psi. T-peel strength 25-30 pli. Cures in 60-75 minutes at 250°F, shorter times at higher temperatures. Successfully tested at 1,000 hours 85°C/85% RH. Serviceable from 4k to +400°F.
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Two component, non-drip, toughened, heat resistant epoxy adhesive. Superior durability and bond strength. Withstands chemical exposure. Paste consistency. Gap filling. Serviceable from -100°F to +500°F. Successfully tested for 1,000 hours 85°C/85% RH. Outstanding thermal cycling capabilities.
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Two part, room temperature curing epoxy polysulfide system with excellent flow. Used primarily for potting, encapsulating and coating applications. One to one mix ratio by weight or volume. Resists exposure to water, gasoline, fuels, oils, hydrocarbons, hydraulic fluids. Outstanding durability and toughness. Service operating temperature range from -80°F to +250°F.
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Flexible, moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Easy processing, high elongation, vacuum compatible. Serviceable from -100°F to +300°F.
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Fast cures under LED light. Outstanding optical clarity, with fluorescent dye. Can be used for small potting and encapsulation, as it can cure up to 1/8 inch thick. Withstands rigorous thermal cycling, mechanical shock and vibration. Serviceable from -100°F to +250°F.
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Thermally conductive silicone casting, potting and sealing system. Thermal conductivity of 0.35-.0.54 W/(m•K). Electrically isolating. Low viscosity system bonds well to a wide variety of substrates. Remarkable flexibility. Temperature resistant from -65°F to +400°F. White color.
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Two component, toughened epoxy system for bonding, sealing, coating and potting derived from natural substances. Low shrinkage upon curing. Exceptional wetting properties. Service temperature range is -100°F to +450°F.
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High flexibility and toughness. Outstanding abrasion resistance. Moderate viscosity. Resists thermal cycling and mechanical shocks. Bonds well to glass, metals, ceramics, composites and many plastics including polycarbonates, acrylics. Serviceable from -80°F to +250°F.