Informazioni di Imballaggio
La Master Bond offre una vasta selezione di soluzioni per l’imballaggio per meglio rispondere alle richieste della tua specifica applicazione. Sono progettati per massimizzare la produttivita’, ridurre gli sprechi e mantenere costantemente elevata l’affidabilita’ del prodotto. Le opzioni per il confezionamento sono disponibili per le resine epossidiche mono e bi-componenti, i poliuretani, i polisolfuri, i siliconi, gli acrilici ed i sistemi di indurimento UV. Inoltre, imballaggio speciale e’ disponibile per i cianoacrilati, i sistemi in lattice ed altre formulazioni di resine.
Le Opzioni di Imballaggio ad alta prestazione della Master Bond
Il nostro particolare imballaggio e’ progettato per applicazioni che variano dalla produzione, progetto e manutenzione alla riparazione e servizi in loco. Il confezionamento Master Bond aderisce ai piu’ restrittivi standard sulla qualita’ per assicurare una consistente affidabilita’ di riproduzione. Le nostre opzioni di imballaggio includono:
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Blister (Imballaggio con divisore flessibile a sacchetta)
Master Bond’s FlexiPak® is a two part flexible divider pouch. It is a reliable and durable form of packaging, offering precise mixing and easy application. Mainly employed for manufacturing and field use, these pouches are ideal for bonding, sealing, coating and potting applications.
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Stampo/Forme modellate al Laser
Master Bond's line of epoxy films can be laser or die cut to different configurations for specific application requirements.
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Duplice componente
Disposable cartridge packaging is another convenient option offered by Master Bond. This form of packaging is most suitable for use with multi component polymer systems such as epoxies, silicones, polysulfides.
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Applicatori a pistola
Master Bond offers a simple to use gun applicator for dispensing two component epoxy systems. Our gun applicators ensure that accurate quantities of Parts A and B are dispensed relieving the uncertainty of complicated mix ratios. Additionally, a wide range of mixers are available to achieve the proper mix and flow rate.
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Sistemi Premiscelati & Congelati
Many Master Bond compounds are available in premixed and frozen syringes or cartridges. Easy to use, these systems require no mixing and cure at room temperature.
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Imballaggio Standard
Master Bond’s versatile and cost effective packaging system employs metal, plastic and glass containers of various sizes. Our containers are offered in oblong to cylindrical shapes and are available in both open and closed head containers for ease of use.
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Siringhe & Cartucce
Master Bond offers a range of syringes and cartridges that can handle free flowing, low viscosity liquids to heavy, high viscosity pastes. These packaging options are designed for ease of use and accurate dispensing.
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Imballaggi Speciali Ultravioletti
Master Bond has developed a highly effective custom resin packaging system for UV curable adhesives, sealants and coatings.
Latest Developments
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Technical Data Sheet Excerpt
EP42HT-2ND-2Med Black Product Information
Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F.
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White Paper
Epoxy Compounds Get Even Tougher
With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties.
Master Bond’s white paper examines the use of these toughened epoxies.
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White Paper
Spotlight on Silicones
Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.
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White Paper
Electrically Conductive Adhesives Make Right Connections
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
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Technical Data Sheet Excerpt
EP37-3FLF Product Information
Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.
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