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Newly Developed Products 2017 - Part 2
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from 2017.
Featured Products
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Specially formulated one component system for bonding and priming polyolefinic surfaces. Can be used as a primer to promote adhesion of polyolefinic substrates to other surfaces such as metals, ceramics. Viscosity 250 cps. Room temperature curing. Serviceable from -60°F to +200°F. Passes ISO 10993-5 for medical devices.
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Flame retardant B-stage toughened epoxy. One part system. Ideal for potting and encapsulation. Capable of withstanding rigorous thermal shocks. Serviceable from -100°F to +500°F. Available in 30 gram cookies.
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One component, heat curable epoxy adhesive. Serviceable from -60°F to +500°F. Paste viscosity. High tensile shear and compressive strength. Chemical resistant. Machinable. Low coefficient of thermal expansion. Meets NASA low outgassing standards.
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High performance two component epoxy system for potting, sealing, encapsulating and casting. Moderate viscosity with good flow. Enhanced dimensional stability and superior thermal cycling resistance. Superb mechanical and electrical insulation properties. Serviceable from -100°F to +300°F.
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Two component low viscosity silicone system. Ideal for potting and encapsulation. Does not require air for curing. Low exotherm; very long pot life. Enhanced low temperature serviceability. Service temperature range of -175°F to +500°F. Superior electrical insulator.
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Serviceable from -80°F to +500°F. Good flow properties. Two component epoxy system. Impressive resistance to aggressive chemicals. Oven curing. Structural adhesive. Superior electrical insulator. Used for filament winding, bonding composites, pultruded structures.