News Releases

Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated…

Master Bond Inc. of Hackensack, NJ is proud to announce an incredible breakthrough in polymer technology. Master Bond UV22 is a nanosilica reinforced, UV curable epoxy system that offers a combination of properties not available in conventional epoxy systems. The nano-sized filler (<50nm) gives the cured system exceptional…

In many challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond has made available new EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature…

Enhancing productivity and simplifying processing are primary concerns of industrial manufacturing companies in our extremely competitive business climate. In order to facilitate the achievements of these crucial goals Master Bond has extended much effort in research and development, and we are proud to announce the formulation…

Master Bond Inc., Hackensack, N.J. has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F). It is an outstanding electrical insulator with a dielectric strength o >400 volts/mil and a volume resistivity greater than 10¹³ ohm-cm. This easy to…