EP21LV3/5Med

Master Bond EP21LV3/5Med is a special two component epoxy system that combines toughness and compliance with USP Class VI specifications. It is a lower viscosity epoxy that can be used for bonding, sealing, coating and encapsulation. This system has a forgiving 60 to 100 mix ratio by weight and a relatively long working life at room temperature. It cures readily at room temperature or more rapidly at elevated temperature. At ambient temperatures, it cures in about 2-3 days, and at 200°F, in about 3 hours. To optimize properties, an overnight cure at room temperature followed by 3-4 hours at 150-200°F, is recommended.

EP21LV3/5Med bonds well to a wide variety of substrates including metals, composites, glass and ceramics as well as many rubbers and plastics. Its toughness makes it particularly useful for bonding dissimilar substrates. It also allows it to resist rigorous thermal cycling that more typical rigid epoxies. Some other attractive features include low shrinkage upon curing along with good resistance to many chemicals including water, cleaning agents, and most significantly, cold steriliants, ethylene oxide (EtO) and radiation. The system is compatible with indirect food contact as per the FDA standard 175.105. It is serviceable over the wide temperature range of -80°F to +250°F. Its potent electrical insulation properties combined with its good flow, also allow it to be used for potting and encapsulation. The color of Part A is clear and Part B is amber clear. EP21LV3/5Med is used primarily for disposable and reusable medical devices, especially in applications where a toughened, forgiving epoxy is better suited to handle requirements than more rigid type systems.

Product Advantages

• Easy to mix and dispense
• Excellent toughness, less stiff than most epoxies
• Excels in withstanding thermal cycling
• Resists most types of sterilization
• Biocompatible as per USP Class VI requirements