Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing. UV15DC80Med allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. It is important to note that the heat curing portion of this system can be initiated at the relatively lower temperature of 80°C.
Bonding
Master Bond UV15DC80LV-FHC is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.
Master Bond EP41S-5Med is a two part epoxy system for bonding, sealing and coating, for use in medical devices. It has a forgiving 100 to 25 mix ratio by weight. It cures at room temperature or more rapidly at elevated temperatures, with the optimum being overnight at room temperature followed by 3-4 hours at 150-200°F. EP41S-5Med has stellar resistance to a wide host of sterilants, including those derived from hydrogen peroxide. It also withstands acids, bases, and aggressive solvents. The system has no solvents or diluents, and low shrinkage upon curing.
Master Bond EP41S-5ND Black is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5ND Black will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels including gasohol, and solvents. Most noteworthy is its resistance to methylene chloride, phenol (10%), nitric acid (30%) as well as ethanol and acetone.
Master Bond EP41S-6 is a two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. The rationale for this test is to prevent explosions and dust ignitions in industrial settings. The 1203 UL designation is specifically for a sealing compound for use in hazardous locations conforming with Class I, Groups A, B, C and D; Class II, Groups E, F, and G Hazardous Locations.
Master Bond EP41S-5LV is a two part epoxy system for potting, bonding, sealing, and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5LV will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has stellar resistance to a wide array of chemicals, especially solvents, alcohols, fuels including gasohol, acids and bases. Most noteworthy is its resistance to ethylene chloride, acetone and ethanol. Upon mixing, EP41S-5LV is a low viscosity liquid with good flow.
Product Advantages
- Exceptionally low mixed viscosity and low exotherm; contains no solvents or other volatiles.
- Long working life at ambient temperatures.
- Superior physical strength and electrical insulation properties.
Master Bond EP21TDC-2AOLV is a two component thermally conductive, electrically insulating epoxy that is very flexible upon curing. It can be used for bonding sealing, coating and encapsulation. In essence, this epoxy system is a lower viscosity version of EP21TDC-2AO. It has a forgiving one to three mix ratio by weight and upon mixing, has a thicker consistency, but good flow. This system will cure at ambient temperatures or more quickly at elevated temperatures (see below). The optimum cure is typically overnight at room temperature, followed by 2-4 hours at 150-200°F.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. The mix ratio is a forgiving one to one by weight, and after mixing, the epoxy flows smoothly. Upon mixing, this lower viscosity system has a relatively long working life. EP39MAOHT will cure at room temperature in 3-5 days. An alternative is to heat cure for 3-4 hours at 150-200°F. An optimum cure schedule would be overnight at room temperature followed by 3-5 hours at 150-200°F.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity(<250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other kinds of materials, such as metals, ceramics, composites and other kinds of plastics. When employed as a primer, X21 is applied in a very thin layer on to the polyolefinic piece and the solvent allowed to evaporate.