EP21TDC-2

Master Bond EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It has a forgiving one to three mix ratio by weight. The system is formulated to cure fully at ambient temperature or more quickly at elevated temperatures. The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. An unusual feature here is that the curing cycle can affect the hardness of the system. If cured only at elevated temperatures, the Shore A hardness is 50-55. If cured with the optimum cure schedule, the Shore A is 75-80. It has very high peel strength and elongation. EP21TDC-2 develops very little exotherm while curing, making it well suited for sealing or encapsulating in thicker sections. It has excellent adhesion to a wide array of substrates including metals, composites, glass, ceramics and many rubbers and plastics. Its superior flexibility allows EP21TDC-2 to have excellent thermal cycling properties along with exceptional resistance to thermal and mechanical shock and vibration. This epoxy is a superb electrical and thermal insulator with good resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. EP21TDC-2 is cryogenically serviceable and has a temperature range of 4K to +250°F. EP21TDC-2 is widely used in aerospace, specialty OEM, optical and especially in applications where robust thermal cycling properties and shock resistance are paramount.

Product Advantages

• Easy application: good flow, product spreads evenly and smoothly
• Cures readily at ambient temperature or faster at elevated temperatures
• Variable hardness and flexibility depending upon cure schedule
• Bonds well to a wide variety of substrates
• Excellent peel strength, dependable resistance to rigorous thermal cycling
• Cryogenic serviceability