Benefits of Using Military Grade Adhesives in Non-Military Industrial and Research Applications

Tech Tip

Some epoxy compounds successfully meet thermal stability testing standard ASTM D3850-12 per MIL-STD-883J Section 3.5.2 & 3.8.5 for military applications, however these systems can also be used across many other industries where thermal stability is an important requirement. The thermal stability test is not just an aggressive check for the high temperature serviceability of such compounds, but it also is an excellent starting point for using such compounds in high temperature applications. Other considerations to keep in mind are the continuous, as well as the maximum service temperature range, thermal cycle ramp speeds, and other thermally induced stresses in the application. Some common non-military applications that benefit from compounds that pass MIL-STD-883J include downhole oil equipment, lasers, satellite systems, electronics, power tools, as well as various automotive applications.

MIL-STD-883J testing for polymers involves thermal stability analysis, by running a Thermogravimetric Analysis (TGA). The thermal stability is determined by heating the specimens from room temperature to 200°C at a heating rate of 10°C/minute in a nitrogen atmosphere. The thermal stability of the cured material is determined by the weight loss at 200°C. For the polymer compound to pass the test, the weight loss must be less than or equal to 1.0 percent of the cured material weight prior to the exposure to the temperatures.

These thermally stable adhesive systems offer many other advantages especially over traditional fastening techniques, such as improved load bearing capacity, stress distribution, resistance to cyclical fatigues, protection against chemicals, and light weighting, to name a few. Designers and engineers must be mindful of the processing considerations such as surface preparation, and cure schedules while selecting the right product. It is best to consult with the supplier’s recommendations while choosing the adhesive, sealant, coating, or potting compound, and also for the best processes to use.

To read more about Master Bond adhesives that passed MIL-STD-883J testing please click here.

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MIL-STD-883J Certified Adhesive Systems

EP17HTDA-1

Single component heat curable epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

EP21TDCHT

High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties.

EP33

Meets MIL-STD-883J Section 3.5.2 for thermal stability. Room temperature curing system. One one mix ratio by volume. Superb chemical resistance and dimensional stability. Shore D hardness 85-90. Suitable for bonding, sealing, coating. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +450°F. Easily machinable.

EP46HT-1AO

Thermally conductive/electrically insulative heat resistant epoxy compound. Requires oven curing. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +550°F. Tg 215-220°C.

Supreme 11AOHT

Thermally conductive, electrically insulative epoxy adhesive. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High peel and shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature.

Supreme 12AOHT-LO

One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH.

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Latest Developments

Case Study

EP114: Utilized to produce nanocomposites via vacuum infiltration

Master Bond EP114 is a two-component nano silica filled epoxy system which offers excellent dimensional stability and a very high glass transition temperature (Tg > 200°C upon curing. Its ultra-low initial mixed viscosity (500–1500 cps at room temperature) can be further reduced by preheating to a slightly higher temperature, making EP114 ideal for vacuum infiltration to produce dense nanocomposites, as shown in the case study below.

EP42HT-2ND-2Med Black Two Part Epoxy System

Technical Data Sheet Excerpt

EP42HT-2ND-2Med Black Product Information

Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F.

White Paper

Epoxy Compounds Get Even Tougher

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

White Paper

Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

White Paper

Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Technical Data Sheet Excerpt

EP37-3FLF Product Information

Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.

Lab Report

Testing Adhesives for Resistance to Xylene

Many Master Bond epoxy systems are formulated with superior chemical resistance. In the lab, we continually test our materials by exposing them to specific chemicals over a long period of time. A common way of testing the chemical compatibility of an epoxy is immersing a sample in a chemical and measuring its change in weight over time. A significant loss or gain in weight would indicate a decreased ability of a material to stand up to chemical exposure. These tests allow us to more accurately recommend the right adhesive based on specific application requirements.In this experiment, we focused on testing our epoxies for their resistance to xylene. The compounds Master Bond used for testing are a variety of two component epoxies and one component UV curing systems with good overall chemical resistance. For the first round of testing the products tested were EP41S-5LV, EP42HT-2AO-1, EP46HT-2AO Black, UV16, UV22DC80-1, and UV26. For the second round of testing the products tested were EP125, EP42HT-2 and UV25. For the final round the products tested were EP41S-5, EP41S-1HT, EP62-1HT and EP62-1. These were compared against the resistance of a generic or standard non-chemically resistant epoxy. A few thin castings, roughly 2 inches in diameter and around 0.125 inches thick, were made for each product and cured in accordance to their specifications. Once the cured samples were created and initial weight was recorded, we submerged them in xylene. Then we continued recording weekly weight measurements. We carried on these tests with frequent weight recording for varying lengths of time based on the products performance. Below you will see the results for soaking results for around 10 months in the first batch, 2 years for the next batch, and greater than 2.5 years for the third batch of products. The castings were weighed periodically and the graphs shown below demonstrate the percentage of weight change over time.For the purpose of comparison, please notice that for each testing timeframe, a casting of a standard epoxy was also tested under these same conditions which served as a reference. As can be seen in the graphs, the standard epoxy was not as resistant to xylene as the other epoxies tested. It demonstrated a significantly greater change in weight over time, and the casting ultimately dissolved in xylene after 15 weeks.In general, a swelling of less than 4-5% can be considered excellent, especially since this test may be more rigorous compared to actual service conditions. It is also worth noting that in the context of a bonded joint or a potted assembly the exposure to xylene might not be as severe or direct as in the above test conditions.Please note, when choosing an epoxy for an application where the resistance to xylene is critical, many other factors must be considered in addition to the chemical resistance. Each of the epoxies in the charts above offers a distinct set of performance properties. For example, if thermal conductivity and high temperature resistance are needed, EP46HT-2AO Black may be a good option. If a fast cure is required and there is full access to a light source with no shadows, UV26 can be considered. For longer term exposure to xylene over several months to a year or longer, the likes of UV25, EP125 EP41S-5, and EP62-1 are excellent candidates. They all need to be processed or cured differently and although some of them can be cured at room temperature alone, for enhancing/optimizing chemical resistance especially to xylene, it is critical to add heat.Disclaimer: The findings in this article are not meant to be used for specification purposes.

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