News Releases

Stay informed about Master Bond's latest product developments, industry news, company events, and other exciting announcements.

	Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications Release Date: 04/02/2018 Product: EP62-1LPSPMed Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or encapsulation.… Read More...
	6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability Release Date: 03/12/2018 Product: EP21TDCHT Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a… Read More...
	Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity Release Date: 02/20/2018 Product: MasterSil 170 Gel Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications. It possesses a low mixed viscosity of 1,000 cps, has a long working life after mixing (2-4 hours for 100 g batch), a low exotherm upon cure and is easy to dispense. This solvent free silicone product… Read More...
	Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion Release Date: 01/29/2018 Product: EP42HT-3AO Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize… Read More...
	Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile Release Date: 01/08/2018 Product: UV22DC80-10F Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally,… Read More...