EP21TPFL-1
Two component, low viscosity epoxy polysulfide for bonding, sealing, coating and casting
Key Features
- Outstanding chemical resistance
- High flexibility
- Electrically insulative
- Cures at room temperature
- Serviceable from -65°F to +250°F
- Suitable for bonding, sealing, coating, encapsulation and casting
Typical Properties
Viscosity
2,000-4,000 cps
Cure Schedule
Cure at 75°F, 3-5 days
Hardness
30-50 Shore A
Service Temperature Range
-60°F to +250°F
Dielectric Constant
3.9
Elongation
>250%
Imagen

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Certifications
Meets EU Directive 2015/863