EP110F8-3

Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life (at least 2-3 days at room temperature). It is used primarily for potting, sealing, encapsulating and casting. This low viscosity system has a convenient and very forgiving one to two mix ratio by weight. It requires an elevated temperature cure at 250-300°F. A typical cure schedule would be 4-6 hours at 250-300°F. For optimum properties, a post cure of 3-5 hours at 350°F is recommended. It should be noted that even without the optional post cure, EP110F8-3 will perform very well. EP110F8-3 has no solvents or diluents and has low shrinkage upon cure.

It adheres well to a wide variety of substrates, including metals, composites, glass and many plastics. At the forefront of its properties are very superior electrical insulation properties. Also, its physical strength properties of low tensile strength, lower modulus and relatively higher elongation, translates into a special capability to resist severe thermal cycling and shock. It has good resistance to water, oils and fuels. The color of Part A is clear while the color of Part B is amber. The service temperature range is -100°F to +300°F. It can be used in applications where very high performance electrical insulation properties and resistance to rigorous thermal cycling is needed.

Product Advantages

• Low viscosity liquid; flows easily
• Long working life at room temperature
• Outstanding thermal shock resistance
• Very high elongation
• Unsurpassed electrical insulation properties