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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21TDCSMed Silver conductive, two component epoxy for medical applications Tensile Lap Shear Strength 800-1,000 psi Volume Resistivity less than 0.001 ohm-cm	RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 2-3 hours at 150-200°F	50-60 Shore D	4K to +250°F	/es/tds/ep21tdcsmed
EP21TP-2NV Two component, epoxy polysulfide for bonding, sealing, coating and encapsulation Dielectric Constant 3.7 Elongation 40-80%	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 4,500-7,500 cps, Part B: 500-3,000 cps	75°F 48-72 hours	40-50 Shore D	-80°F to +250°F	/es/tds/ep21tp-2nv
EP21TPFL-1 Two component, low viscosity epoxy polysulfide for bonding, sealing, coating and casting Dielectric Constant 3.9 Elongation >250%	RoHS Compliant	Bonding Sealing Coating Casting	2,000-4,000 cps	Cure at 75°F, 3-5 days	30-50 Shore A	-60°F to +250°F	/es/tds/ep21tpfl-1
EP21TPFL-1AO Flexible two component epoxy polysulfide system for high performance bonding, sealing, coating and potting Dielectric Constant 4.5 Elongation 150-200%	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 15,000-30,000 cps, Part B: 14,000-28,000 cps	75°F, 3-5 days	70-90 Shore A	-60°F to +250°F	/es/tds/ep21tpfl-1ao
EP21TPHT Two component, epoxy polysulfide for bonding, sealing, coating and encapsulation Dielectric Constant 3.9 Elongation 20-40%	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 90,000-140,000 cps, Part B: 500 - 2,000 cps	48-72 hours at 75°F; optimum cure overnight at 75°F, followed by 2-3 hours at 150°F	55-65 Shore D	-80°F to +350°F	/es/tds/ep21tpht
EP21TPLV-NV Two component, room temperature curing epoxy polysulfide system Dielectric Constant 4.1 Elongation 40-80%	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 3,000-4,000 cps, Part B: 500-2,000 cps	75°F: 48-72 hours	40-50 Shore D	-80°F to +250°F	/es/tds/ep21tplv-nv
EP21TPND-NV Two component, paste-like epoxy polysulfide for bonding, sealing and coating Dielectric Constant 3.7 Elongation 20-30%	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	48-72 hours at 75°F	40-50 Shore D	-80°F to +250°F	/es/tds/ep21tpnd-nv
EP22 Aluminum filled, two component epoxy adhesive for bonding, sealing and coating Coefficient of Thermal Expansion 35-40 in/in X 10⁻⁶/°C Dielectric Constant 7.5	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 70,000-100,000 cps, Part B: 100,000-150,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours	>80 Shore D	-60°F to +250°F	/es/tds/ep22
EP29LP Two part, very low viscosity epoxy for bonding, sealing, potting and filament winding Dielectric Constant 3.9 Dielectric Strength 450 volts/mil	RoHS Compliant	Bonding Encapsulation Potting Coating Sealing Casting	600-1,700 cps	Optimum cure schedule: 75°F for 12-24 hours, followed by a post cure of 4-5 hours at 200°F.	>75 Shore D	-60°F to +250°F	/es/tds/ep29lp
EP29LPAO Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications Coefficient of Thermal Expansion 22-24 x 10⁻⁶ in/in/°C Dielectric Constant 4.4	RoHS Compliant	Potting Encapsulation Casting Sealing	Part A: 20,000-40,000 cps, Part B: 5,000-15,000 cps	EP29LPAO cures at 75°F in 5-7 days or 6-8 hours at 140-180°F. The best cure schedule is overnight at 75°F followed by 4-5 hours at 150°F.	80-90 Shore D	-60°F to +250°F	/tds/ep29lpao

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