Adhesive Systems for the Photonics Industry
From telecommunications, robotics and medicine to information processing, Master Bond has the solution to your photonic application needs. Master Bond offers the widest selection of epoxies, silicones, polyurethanes, cyanoacrylates and UV cures for the photonics industry.
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Performance Properties of Master Bond’s Photonics Industry Adhesives
Master Bond’s specialty formulations for the photonics industry offer outstanding performance properties. Specific grades offer:
- High optical clarity
- Abrasion resistance
- Superior non-yellowing properties
- NASA low outgassing approval
- Resists 1,000 hours of exposure to 85°C and 85% humidity
Most Popular Adhesives, Sealants and Coatings for Photonic Applications
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Thermally stable, room temperature curing epoxy. Features high optical clarity and superior physical strength properties. Passes ASTM E595 tests for NASA low outgassing. Electrically insulative. Dimensional stable, rigid bonds. Low shrinkage upon cure. Well suited for smaller potting and encapsulation applications. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +300°F.
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Low viscosity, rigid UV curable system with superb thermal stability. Also capable of spin coating. Outstanding optical clarity. High bond strength. Serviceable from -80°F to +350°F.
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Single component, UV curable. Unsurpassed dimensional stability. Extended service capability of -65°F to +300°F. High optical clarity. Shore D hardness >60. Resistant to water, oils, cleaning agents, acids and bases. Excellent toughness.
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High viscosity, two part epoxy that is opaque, with light white color. High optical opacity. Cures at room temperature or more rapidly with heat. Low linear shrinkage. Good physical strength properties.
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Two component optically clear epoxy system. Special cross linking profile that allows for exceptional light transmission in the 250-365 nm spectra Long pot life. Low viscosity. Excellent physical strength properties. Serviceable from -60°F to +250°F.
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Two component, room temperature curing non-flowing epoxy paste. Cures optically clear in thin sections. Superior physical strength profile. Non-critical one to one mix ratio by weight or volume. Service temperature range from -60°F to 250°F. Withstands 1,000 hours 85°C/85% RH.
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Dual cure system with UV and heat curing mechanisms. Fast cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Minimal shrinkage upon curing. Serviceable from -60°F to +350°F.