UV22DC80TK

Master Bond UV22DC80TK is a nanosilica filled, UV dual cure system. The secondary cure is accomplished by adding heat, with the minimum temperature being 80°C. Essentially, this epoxy based system will cure readily upon exposure to UV light and if there are any shadowed out areas, heating at 80°C will complete the cure. The 80°C curing feature is particularly useful given the sensitivity of many plastics to elevated temperatures.

The consistency of UV22DC80TK can best be described as thixotropic, moderate viscosity. It dispenses readily, but it is not as free flowing as lower viscosity versions. This UV is a cationic type cure and is not oxygen inhibited. It bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. UV22DC80TK has very good chemical resistance to many acids, bases, fuels and solvents. It is a superb electrical insulator, also it is able to withstand rigorous thermal cycling. The service temperature range is -60°F to +350°F. As a nanosilica filled system, it has exceptionally low shrinkage upon curing and stellar dimensionally stability.

Typically the UV portion occurs in 10-30 seconds at 365 nm with 10-40 milliwatts/cm² of output. Areas not cured because of shadowing effects can be readily cured at 80°C for 30-60 minutes. Post curing at 125-150°C for 15-30 minutes will increase the T_g. Significantly, in addition to bonding, this UV can be used for small encapsulations as it will cure in thickness up to 0.075 inches. The combination of special flow properties and dual curing is especially intriguing. This epoxy is a viable option for high tech aerospace, electronics, optical and specialty OEM applications.

Product Advantages

• One component system; no mixing needed
• Dual curing mechanism allows for curing in shadowed out areas and rapid fixturing time at 80°C
• No oxygen inhibition
• Very low shrinkage upon curing
• Nano filled, high dimensional stability
• NASA low outgassing