Infographic Page

Low CTE Epoxy for Precise Alignment

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.

Low CTE Epoxy

Featured Products