FL901AO
One component, thermally conductive film for high performance bonding and sealing
Key Features
- Convenient handling
- Good storage stability
- Uniform bond line thickness
- Passes NASA low outgassing
Typical Properties
Viscosity
Film system
Cure Schedule
oven curing for 1 hour at 250°F or 40-45 minutes at 300°F
Service Temperature Range
-100°F to +400°F
Dielectric Constant
4.1
Volume Resistivity
>10¹⁴ ohm-cm
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(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
Applications
Certifications
Meets EU Directive 2015/863
ASTM E595 Compliant
Vidéo
FL901AO: How Do You Use an Epoxy Adhesive Film?
Follow this step by step video on how to apply epoxy adhesive film FL901AO or similar film systems.From packaging all the way through to the application process you will learn how to easily work with and apply the material.