EP21ARLV

Master Bond EP21ARLV is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight and is formulated to cure at ambient temperatures or more quickly at elevated temperatures. The optimum cure is overnight at room temperature followed by 4 to 6 hours at 150-200°F. EP21ARLV is 100% reactive and contains no solvents or diluents. It has very low linear shrinkage upon cure.

The primary purpose of utilizing EP21ARLV is to obtain exceptional acid resistance. The chart below describes its resistance to a wide range of acids. EP21ARLV bonds well to several substrates including metals, ceramics, composites, as well as many plastics and rubbers. The service temperature range is from -60°F to +250°F. The color of Part A is clear and Part B is amber clear. It is available in various colors upon request. EP21ARLV can be used as an adhesive, sealant, or coating. Significantly, it is free flowing and aptly suited for potting and encapsulation. It is particularly useful for coating tanks and vessels that contain acids. EP21ARLV is a candidate for aerospace, electronic, electrical, chemical processing and OEM where acid resistance is needed.

Product Advantages

• Convenient 2 to 1 mix ratio by weight
• Versatile cure schedules
• Dependable electrical insulator
• Good flow, easy to apply
• Bonds well to many substrates
• Available in many colors