Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and sealing. It has a forgiving one to one mix ratio by weight or volume. It cures at room temperature or more rapidly at elevated temperatures with an optimum cure of 8-12 hours at room temperature followed by 1-2 hours at 150-200°F. The epoxy has very low shrinkage upon curing.
It bonds well to a wide variety of substrates including metals, composites, ceramics, glass and many plastics. Supreme 11ANHT-2 provides thermal conductivity because of a small particle size aluminum nitride filler. This allows for the epoxy to be applied in very thin sections, and ultimately lowers the thermal resistance. With standard type alumina filled thermally conductive epoxy, thermal resistance values range from 30-40 x 10-6 K•m2/W. With Supreme 11ANHT-2, the thermal resistance would be about half of this value, ultimately imparting better heat transfer.
Other noteworthy features include its being a toughened system that withstands thermal cycling and mechanical and thermal shock. It has exceptionally good adhesion in both shear and peel modes. This epoxy resists chemicals such as water, oils, and fuels, as well as many acids and bases. The colors of Parts A and B are gray. The service temperature range is -112°F to +400°F. This product is a solid choice in electronic, optical, aerospace and specialty OEM applications, where superior heat transfer is advantageous. Supreme 11ANHT-2 would be most useful when a strong bonding agent with good thermal conductivity and low thermal resistance is an important consideration.
- Easy processing; 1:1 mix ratio by weight or volume
- Toughened system, withstands thermal cycling
- Exceptionally strong adhesive
- Small particle size allows for thin bond lines and low thermal resistance
