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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
Supreme 10HTN-NV One component, heat curing, nickel conductive epoxy system Tensile Lap Shear Strength 1,200-1,400 psi Volume Resistivity 5-10 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	minimum 250°F for 60-90 minutes	85-95 Shore D	4K to 400°F	/fr/tds/supreme-10htn-nv
Supreme 10HTND-3 One component, toughened epoxy system Tensile Strength 8,000-9,000 psi Tensile Modulus 450,000-500,000 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	60-75 minutes at 250°F	75-85 Shore D	4K to +400°F	/fr/tds/supreme-10htnd-3
Supreme 10HTS One component, heat curing, toughened epoxy system Tensile Lap Shear Strength >1,200 psi Volume Resistivity <0.006 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	>500,000 cps	250°F for 60-75 minutes, 300°F for 40-45 minutes	>75 Shore D	4K to +400°F	/fr/tds/supreme-10hts
Supreme 112 Two part epoxy for bonding, sealing, potting and impregnation requires elevated temperature curing Glass Transition Temperature (Tg) 190-195°C Volume Resistivity >10¹⁴ ohm-cm at 25°C, >10¹² ohm-cm at 150°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Impregnation Coating Encapsulation Gap Filling	50-200 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F	75-90 Shore D	-80°F to +550°F	/fr/tds/supreme-112
Supreme 11AOHT Two component thermally conductive, electrically insulative epoxy compound for bonding, coating and sealing Dielectric Constant 4.6 Tensile Lap Shear Strength 3,200-3,400 psi	MIL-STD-883J for Thermal Stability RoHS Compliant	Bonding Coating Sealing Gap Filling	Part A: 200,000-300,000 cps, Part B: paste	8-12 hours at 75°F, plus 1-2 hours at 150-200°F	80-85 Shore D	-112°F to +400°F	/fr/tds/supreme-11aoht
Supreme 11AOHT-LO Toughened, high strength, two component epoxy for bonding and sealing Coefficient of Thermal Expansion 35-40 X 10⁻⁶ in/in/°C Tensile Lap Shear Strength 3,200-3,400 psi	1,000 Hours at 85°C/85% RH RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating	Part A: 200,000-300,000 cps, Part B: paste	overnight at 75°F followed by a few hours at 150-200°F	80-90 Shore D	-112°F to +400°F	/fr/tds/supreme-11aoht-lo
Supreme 11AOHTLP Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Dielectric Constant 4.6 Tensile Modulus 400,000-450,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-4 hours at 150-200°F	85-90 Shore D	-112°F to +400°F	/fr/tds/supreme-11aohtlp
Supreme 11AOHTMed Toughened, high strength, two component epoxy for bonding and sealing Dielectric Constant 4.6 T-peel Strength 15-20 pli	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 200,000-300,000 cps, Part B: paste	75°F: 24-36 hours; 200°F: 1-2 hours	80-90 Shore D	-112°F to +400°F	/fr/tds/supreme-11aohtmed
Supreme 11HT Toughened, two component epoxy for bonding, sealing and coating Coefficient of Thermal Expansion 45-50 X 10⁻⁶ in/in/°C Tensile Lap Shear Strength 3,200-3,400 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 90,000-120,000 cps, Part B: 60,000-110,000 cps	overnight at 75°F, followed by 1 hour at 150-200°F	75-85 Shore D	-112°F to +400°F	/fr/tds/supreme-11ht
Supreme 121AO Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Glass Transition Temperature (Tg) 200-210°C Thermal Conductivity 4-5 BTU•in/(ft²•hr•°F)	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Potting Coating Gap Filling	10,000-25,000 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.	85-95 Shore D	-80°F to +550°F	/fr/tds/supreme-121ao

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