News Releases

Stay informed about Master Bond's latest product developments, industry news, company events, and other exciting announcements.

	Electrically Insulative Two Component Epoxy Features High Elongation Release Date: 09/19/2023 Product: EP21LVFL Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram batch and features a flowable initial mixed viscosity of 10,000-14,000 cps. This epoxy generates low exotherm making it suitable not only for bonding… Read More...
	Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications Release Date: 07/31/2023 Product: EP40TCMed Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications. This toughened… Read More...
	One Part, Toughened Epoxy for Dam-and-Fill Encapsulation Release Date: 07/14/2023 Product: Supreme 3DM-85 Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and… Read More...
	Thixotropic Epoxy Features Low Coefficient of Thermal Expansion Release Date: 05/01/2023 Product: EP5LTE-100 Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are… Read More...
	Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements Release Date: 04/18/2023 Product: EP17HTDA-2 Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical… Read More...