Adhesives for Microwave and RF Applications

Efficient Thermal Management

Due to the growing demands for more compact lower frequency electronic devices, efficient thermal management is of paramount importance. Our new age adhesives offer superior heat transfer capabilities and low coefficient of thermal expansion for use in applications such as power conversion modules, automotive engine control modules, LEDs and lighting modules.

Key Performance Properties for Microwave and RF Adhesives

For microwave and RF applications, the choice of adhesive is driven by specific performance properties that directly impact device functionality and longevity. Adhesives must offer precise electrical characteristics, including excellent electrical insulation or, conversely, high electrical conductivity for effective grounding and EMI/RFI shielding. Maintaining signal integrity at high frequencies also necessitates materials with a low dielectric constant and low dissipation factor (loss tangent). Thermal management properties like high thermal conductivity and a low coefficient of thermal expansion (CTE) are vital to dissipate heat generated by compact, powerful components and prevent stress from thermal cycling. Beyond these, robust mechanical properties such for bond strength, flexibility, and resistance to shock and vibration, alongside comprehensive environmental resistance to moisture, humidity, and extreme temperatures, ensure long-term reliability in demanding operational environments.