EP62-1LPSP

Master Bond EP62-1LPSP combines user friendly processing along with exceptional product properties after curing. Notably, this system passes NASA low outgassing tests. It has a very forgiving mix ratio of 100:25 by weight. Upon mixing, the viscosity is markedly low and the working life is impressively long. Curing is straightforward and easy, simply heat for 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C or 30-60 minutes at 125°C. Post curing at 100-150°C for 3-4 hours will help optimize properties. (Please see the cure section for more details.) EP62-1LPSP blends an array of attractive physical strength properties and reliable electrical insulation values. It bonds well to a wide variety of substrates including metals, composites, glass and many plastics. It has outstanding thermal stability with a temperature range extending from 4K to +400°F. Its chemical resistance is extensive, ranging from water, fuels, oils, solvents, acids and bases. It has splendid optical clarity as well. Its thin consistency, long open time and low exotherm upon curing allows this system to be used for moderate and larger sized electrical encapsulations. One very special and unusual property of this system is adding heat will greatly lower the viscosity for a relatively longer time span. For example, at 40°C, the viscosity drops 60-90 cps. After 20 minutes, it is only about 100-110 cps, and after 40 minutes it is 160-190 cps. (This data is summarized below.) EP62-1LPSP is highly versatile and can be used in aerospace, electronic, fiber-optic, optoelectronic and specialty OEM applications where this favorable mix of product properties is desirable.

Product Advantages

• Easy to use, forgiving 100 to 25 mix ratio by weight
• Long working life
• Superior resistance to a wide variety of chemicals
• Highly useful electrical insulation properties
• Top notch physical strength attributes
• Well suited for impregnation applications