Supreme 11LV

Toughened, two component epoxy for bonding, sealing and coating
Key Features
  • Convenient handling
  • Good shear and peel strength
  • Withstands thermal cycling
  • Low modulus
Typical Properties
Viscosity
Part A: 1,000-4,000 cps., Part B: 24,000-30,000 cps.
Cure Schedule
75°F: 24-48 hours; 150°F: 1-2 hours.
Hardness
55-65. Shore D
Service Temperature Range
-100°F to +250°F
Coefficient of Thermal Expansion
55-60 X 10⁻⁶ in/in/°C.
Dielectric Constant
4.1.
T-peel Strength
15-25 pli.
Tensile Lap Shear Strength
1,500-1,700 psi.
Tensile Modulus
30,000-40,000 psi.
Volume Resistivity
>10¹³ ohm-cm.
Immagine
Two Part Epoxy Supreme 11LV
Certifications

Meets EU Directive 2015/863

Product Description

Master Bond Supreme 11LV is a high performance, lower viscosity, two part epoxy for bonding, sealing and coating. It has an easy to use one to one mix ratio by weight or volume. Supreme 11LV is a faster setting system and cures readily at room temperature or more quickly at elevated temperatures. The optimum cure schedule is overnight at room temperature, followed by 30 to 60 minutes at 150°F. It is 100% reactive and has low shrinkage upon curing.

Supreme 11LV bonds well to a wide variety of substrates including metals, glass, ceramics, composites, many rubbers and plastics. It is a toughened system with good strength in both shear and peel modes. It withstands rigorous thermal cycling as well as impact and shock. Upon curing, it is a highly reliable electrical insulator. The service temperature range extends from -100°F to +250°F. It has superior resistance to water, oils and fuels. The color of Part A is gray and Part B is amber. Additionally, it is noteworthy for having a low tensile modulus. Ultimately, Supreme 11LV should be considered in specialty applications where a faster setting epoxy and the product properties summarized within are desirable.

Product Advantages

  • Convenient, non-critical 1:1 mix ratio
  • Easy to apply, free flowing
  • Toughened system, resists cycling and shock
  • Combines high bond strength and low modulus
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