MasterSil 151AN

Two component silicone compound for casting, potting, encapsulation and sealing
Key Features
  • Excellent electrical insulation
  • High degree of thermal conductivity
  • Very good flow properties
  • Superb thermal shock resistance
  • Low exotherm system
  • Suitable for potting, encapsulation and casting
Typical Properties
Viscosity
Part A: 35,000-65,000 cps, Part B: 30-100 cps
Cure Schedule
48-72 hours at 75°F; 2-3 hours at 200°F
Hardness
75-85 Shore A
Service Temperature Range
-65°F to +400°F
Dielectric Strength
450 volts/mil
Elongation
120-150%
Immagine
MasterSil 151AN Two Part Silicone Compound
Certifications

Meets EU Directive 2015/863

Packaging
Product Description

Master Bond MasterSil 151AN is a two component, low viscosity silicone compound for high performance potting and encapsulation. This system combines high temperature resistance, superior flexibility, very high thermal conductivity and superb electrical insulation properties. It is an addition cured system and does not require exposure to air for complete cross-linking. It has a 100 to 4 mix ratio by weight. It is 100% solids, contains no solvents or diluents and will not outgas while curing. MasterSil 151AN system is a low viscosity making it highly desirable for potting and encapsulation. As a silicone system, it offers excellent flexibility and high temperature resistance. Its flexibility allows it to withstand severe thermal cycling and resist vibration and shock. Also, it is very water resistant. These properties make this system well suited for applications involving sensitive optical and electronic components where heat dissipation is critical. Some additional applications include heat sink attachment, potting sensors and thermocouple applications, among many other uses. MasterSil 151AN is gray in color. The service temperature range for this system is -65°F to +400°F.

Product Advantages

  • Addition cured; no by-products released during cure; does not require air for curing
  • Low exotherm; very long pot life
  • Readily cures at ambient temperatures or faster cure at elevated temperatures
  • Can cure in thicknesses up to and beyond 1-2 inches
  • Very low shrinkage upon cure
  • Low viscosity ideal for potting and encapsulation
  • Superior electrical insulation properties
  • Outstanding flexibility combined with high temperature resistance
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