Impregnation Applications

From automotive to electronics to construction equipment to communications systems, Master Bond has developed cost effective solutions for sealing macroporosity and microporosity for metals and other materials. These low viscosity systems cure at elevated temperatures to a tough, strong chemical resistant thermoset plastic.

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Filament winding

Master Bond offers a broad range of epoxy resin systems for the fabrication of filament wound composite parts. Oven/autoclave curing epoxy coated/impregnated reinforced fibers including glass, carbon, aramid, boron are uniformly, precisely wrapped around a cylindrical, spherical, conical rotating mandrel automatically to produce composite structures.

Properties for Impregnation Epoxy Adhesives

Vacuum impregnation

Single part, no mix, solvent free epoxy impregnation compounds are used to seal porosity in metals and non-metals. Compounds offer excellent void filling capability, low shrinkage upon cure and cause no dimensional change to parts being sealed.

Prepregs

Master Bond B-stage epoxy systems are pre-impregnated on a reinforcing fabric such as carbon, glass, aramid, hybrid fibers, layered on a mold and cured with heat/pressure for repeatable, uniform laminations. Prepregs offer many advantages over other processes for composite fabrication.

Advantages of Master Bond Impregnation Resins

Master Bond impregnation compounds feature long-term storage stability, exceptional chemical/moisture resistance and the ability to withstand elevated temperatures. Additionally, they are fast curing, 100% reactive and easy to process.

A wide range of high quality products have been developed to offer the most reliable sealing solutions and meet specific customer specifications in metal casting, powdered metal parts, electronic/electrical components, ceramic and plastic composite applications. These impregnants have proven attractive in extending design options, accelerating productivity, lowering warranty expenses and shortening testing procedures. In many cases they have successfully outperformed competitive chemistries in difficult part configurations and have prevented part failure from fluids/gases while filling voids between two dissimilar surfaces.

Most Popular Epoxy for Impregnation Applications

EP19HT

One component, storage stable epoxy resin system. Viscosity 500-600 cps. Tensile strength over 10,000 psi. Excellent chemical resistance. Thermal stability up to +400°F. Superb electrical insulation properties. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +400°F.

EP19HTLV

Ultra low viscosity, thermally stable high performance system. Tg 125-130°C. Resists water, oils, fuels and most solvents. Superior adhesion to metal and ceramics. "Unlimited" working life at room temperature. Serviceable up to 400°F. Ideal for impregnation of porous surfaces.

EP19HTFL

Toughened, ultra low viscosity no mix formulation. Shore D hardness >65. Resists impact and thermal cycling. Light amber clear color. Outstanding physical strength properties. Used for sealing/impregnation of porous surfaces. Serviceable from -60°F to +350°F.

EP4CL-80

One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear.

EP62-1LPSPMed White

Sterilization resistant, cryogenic ISO 10993-5 epoxy for medical device assembly. White pigment. Low viscosity.

Latest Developments

EP42HT-2ND-2Med Black Two Part Epoxy System

Technical Data Sheet Excerpt

EP42HT-2ND-2Med Black Product Information

Two component epoxy paste adhesive. Resists sterilization exposure. USP Class VI approved. Outstanding thermal stability and electrical insulation properties. Cures at ambient temperatures. Withstands multiple cycles of autoclaving, radiation, EtO and chemical sterilants. Post curing is recommended to optimize physical properties. Serviceable from -60°F to +450°F.

White Paper

Epoxy Compounds Get Even Tougher

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

White Paper

Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

White Paper

Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Technical Data Sheet Excerpt

EP37-3FLF Product Information

Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.

Find the Right Material for Your Application

With thousands of formulations, our expert engineers provide personalized guidance to ensure you select the ideal material for your specific needs.

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