News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard Release Date: 05/19/2025 Product: EP3HTSDA-2Med Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver filled system, it exhibits high electrical conductivity (volume resistivity… Read More...
	Toughened, UV Curable Adhesive Features Optical Clarity Release Date: 04/22/2025 Product: UV15-7HP Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm² using a UV light source emitting at a wavelength of 320-365 nm. The material… Read More...
	Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation Release Date: 03/24/2025 Product: EP29LPSPND-3 Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures… Read More...
	Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light Release Date: 02/25/2025 Product: LED415DC90Med Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405 nm LED light, followed by a short 30-45 minute heat cure at 90-95°C, making it well-suited for bonding heat sensitive… Read More...
	Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications Release Date: 01/20/2025 Product: EP53TC Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,… Read More...