EP19HTLV-2

Master Bond EP19HTLV-2 is a one component very low viscosity epoxy for high performance impregnation, sealing and coating. It has unlimited working life at room temperature as it requires an elevated temperature cure at 250-300°F. The optimum curing schedule is 1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F. EP19HTLV-2 bonds well to a wide variety of substrates such as ceramics, metals, composites, glass and many plastics. It combines outstanding physical strength properties with compelling electrical insulation properties. It has first rate chemical resistance to water, oils, fuels and many solvents. Its low viscosity allows for easy brushing or spraying for the surfaces to be impregnated, laminated or sealed. It is a light amber clear system. The service temperature range extends from -60°F to +400°F allowing it to be used in a variety of applications requiring higher temperature resistance. It combines exceptionally low viscosity, impressive physical property profile and easy handling. This combination enables it to be a wonderful product for specialty aerospace, electronic and OEM type applications where surfaces, especially metals and ceramics, require impregnation, lamination or coating. When impregnating, it is most effective when applied under vacuum, although this is not mandatory.

Product Advantages

• Ultra low viscosity; ideal for impregnation applications; sprayable or brushable
• Unlimited working life at room temperature
• Excellent physical strength properties
• Outstanding electrical insulation
• Superior heat resistance up to +400°F
• Good adhesion to a wide variety of substrates