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Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing. UV15DC80Med allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. It is important to note that the heat curing portion of this system can be initiated at the relatively lower temperature of 80°C.

Master Bond UV15DC80LV-FHC is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity(<250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other kinds of materials, such as metals, ceramics, composites and other kinds of plastics. When employed as a primer, X21 is applied in a very thin layer on to the polyolefinic piece and the solvent allowed to evaporate.

Master Bond X18 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X18 is a low viscosity(<2,500) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other kinds of materials, such as metals, ceramics, composites and other kinds of plastics. When employed as a primer, X18 is applied in a very thin layer on to the polyolefinic piece and the solvent allowed to evaporate.

Master Bond X5G is an easy to use, solvent based elastomeric system with reliable electrical conductivity. X5G has a paste-like consistency and when used as an adhesive, it is simply applied in a thin layer to one of the substrates. The surfaces are then coupled, fixtured and the product is allowed to cure. X5G can also be applied in the same manner for coating. Curing takes place by the evaporation of the solvent.

Master Bond X5N is a solvent based elastomeric system with good electrical conductivity. It has a paste-like consistency and is very easy to use. When used as an adhesive, it is simply applied in a thin layer to one of the substrates. The surfaces are then mated and fixtured, and the product is allowed to cure. Additionally, it can be applied in a similar manner as a coating material for shielding purposes. Curing in either case is generated by the evaporation of the solvent.

Master Bond X5SC is a solvent based elastomeric system with superb electrical conductivity. It has a paste-like consistency and is very easy to use. When used as an adhesive, it is simply applied in a thin layer to one of the substrates. The surfaces are then mated and fixtured, and the product is allowed to cure. Additionally, it can be applied in a similar manner as a coating material for shielding. Curing in either case is generated by the evaporation of the solvent.

Master Bond UV15DC80LV is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” issues. Most noteworthy is that the heat cure portion can be initiated at only 80°C rather than at the more common 125°C. Another very useful feature of a dual cure UV is that it allows for rapid fixturing and then enables the cure to be completed by adding heat.

Master Bond EP3SP5FL-ND2 is a special epoxy adhesive that requires no mixing, offers an unsurpassed curing speed of 1-2 minutes at 300°F and a very good performance profile. It is a paste viscosity with minimal flow upon curing that is easy to apply. Since it requires curing at 300°F, it essentially has unlimited working life at room temperature. It will bond well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics.

Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply. Supreme 10HTF-1 is a true one part system; it is not premixed and frozen and has an unlimited working life at room temperature. It is rapid curing: 5-10 minutes at 300°F or 15-20 minutes at 250°F. It should be noted that post curing at 250-300°F for 1-2 hours will help optimize the properties.