EP36FR

Master Bond EP36FR is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring flame retardancy. It meets the Airbus specifications mentioned above. This epoxy features good heat resistance along with some flexibility at elevated temperatures. It can withstand thermal and mechanical shocks and resists rigorous thermal cycling. EP36FR bonds well to a variety of substrates including metals, composites, glass and many plastics. It has good chemical resistance to water, fuels and oils. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn; particularly, electronic components. This one component system is primarily used for potting but can also be used for bonding and sealing.

EP36FR retains toughness and heat resistance up to 500°F without losing its critical properties. The hardness remains consistent (20-30 Shore D) above its T_g up to 500°F, and it is still able to withstand rigorous thermal cycling.

And while EP36FR is an unconventional epoxy, it is conveniently available in 30 gram preforms as well as 1/2 pints and pints. It is a B-staged material meaning that it is packaged as a partially cured system. More specifically, it is a solid at room temperature. Since it is a solid; it must be heated in a forced air or convection oven at 200°F for about 30 minutes to transform it to a liquid. The working life at this temperature is 60-75 minutes. To complete the cure, the temperature should be 350°F for 2-3 hours.

Liquefied but uncured material can be reused by allowing EP36FR to resolidify at room temperature. Cured material cannot reliquefy; resolidified epoxy can become liquid again. This epoxy is black in color. A more detailed description of curing the 30 gram preform appears in the cure section below. EP36FR is truly a Specialty type system that is primarily used in electronic and aerospace applications. The temperature range is -100°F to +500°F. EP36FR is ideal for potting and encapsulation applications where electrical isolation and the ability to withstand severe thermal cycling over a wide temperature range are needed.

Product Advantages

• One component system
• Combines flexibility and toughness with high temperature resistance
• Ideal for potting and encapsulation
• Unused material is easy to reprocess
• Withstands rigorous thermal cycling and shocks
• Non halogen filler