EP41S-5LV

Two component epoxy system featuring excellent chemical resistance especially to solvents, acids, bases, alcohols and fuels
Key Features
  • Convenient handling
  • Low exotherm
  • Superior electrical insulation properties
  • Withstands aggressive chemicals including methylene chloride
Typical Properties
Viscosity
2,000-5,000 cps
Cure Schedule
75°F: 3-5 days; 150-200°F: 2-3 hours
Hardness
85-95 Shore D
Service Temperature Range
-80°F to +350°F
Glass Transition Temperature (Tg)
120-125°C
Volume Resistivity
>10¹⁴ ohm-cm
Bild
Low viscosity, chemically resistant epoxy system EP41S-5LV
Product Description

Master Bond EP41S-5LV is a two part epoxy system for potting, bonding, sealing, and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5LV will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has stellar resistance to a wide array of chemicals, especially solvents, alcohols, fuels including gasohol, acids and bases. Most noteworthy is its resistance to ethylene chloride, acetone and ethanol. Upon mixing, EP41S-5LV is a low viscosity liquid with good flow. It contains no solvents or diluents and is 100% reactive. It has low shrinkage upon curing. This epoxy combines formidable physical strength properties and electrical insulation values. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics, as well as many rubbers and plastics. EP41S-5LV is serviceable over a wide temperature range of -80°F to +350°F. After mixing the color of EP41S-5LV is amber clear although additional colors are also available. This epoxy system can be used in aerospace, electronic, chemical processing, and specialty OEM. It is specially useful for potting and encapsulation where robust chemical resistance is desirable.

Product Advantages

  • User friendly handling and convenient curing
  • Low viscosity
  • Reliable electrical insulation properties
  • Well suited for potting and encapsulation
  • Resists different groups of chemicals, especially solvents
  • Meets NASA low outgassing specifications
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