EP30LTE-LO Black
Two component epoxy for bonding, sealing, coating and encapsulating featuring a very low coefficient of thermal expansion
Key Features
- Good flow properties
- Very low shrinkage
- Withstands 1,000 hours 85°C/85% RH
- Passes NASA low outgassing
Typical Properties
Cure Schedule
Overnight at 75°F followed by 4-8 hours at 150°F to 200°F
Hardness
85-95 Shore D
Service Temperature Range
4K to +250°F
Coefficient of Thermal Expansion
15-18 X 10⁻⁶ in/in/°C
Dielectric Constant
4.5
Bild

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Applications
Certifications
ASTM E595 Compliant
Meets EU Directive 2015/863
1,000 Hours at 85°C/85% RH
Packaging