Product Advantages
- Exceptionally low mixed viscosity and low exotherm; contains no solvents or other volatiles.
- Long working life at ambient temperatures.
- Superior physical strength and electrical insulation properties.
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Master Bond EP31ND is a two part epoxy system used mostly for bonding, but is also serviceable for sealing and encapsulation. This compound has a forgiving mix ratio of 100 to 30 by weight and contains no solvents or diluents. It cures readily at room temperature or more rapidly at elevated temperatures. At ambient temperatures it cures in about 1-2 days, and at 200°F, the curing time is about 2-3 hours. To optimize properties, an overnight cure at room temperature followed by 2-3 hours at 150-200°F is desirable.