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EP30HV Two Part Epoxy Compound
EP30HV
Two component, high performance epoxy system
Dielectric Strength
450 volts/mil
Refractive Index
1.55
  • NASA Low Outgassing
  • RoHS Compliant
  • FDA Food Grade 21 CFR 175.105
  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation
  • Gap Filling
Part A: 9,000-15,000 cps, Part B: 250-500 cps 75°F: 24-48 hours; 200°F: 2-3 hours 75-85 Shore D -60°F to +300°F /de/tds/ep30hv
EP30LP-2 Two Component Epoxy
EP30LP-2
High performance two part epoxy for bonding, coating, sealing and encapsulation
Dielectric Strength
440 volts/mil
Refractive Index
1.56
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
  • Potting
Part A: 900-1,600 cps, Part B: 100-400 cps overnight at 75°F, followed by 2-3 hours at 150°F 75-85 Shore D -60°F to +250°F /de/tds/ep30lp-2
EP30LTE-2 Two Part Epoxy
EP30LTE-2
Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulating with low coefficient of thermal expansion
Acoustical Impedance
6.4 MRayl
Coefficient of Thermal Expansion
10-13 X 10⁻⁶ in/in/°C
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Potting
  • Gap Filling
70,000-100,000 cps overnight at 75°F followed by 2-4 hours at 150-200°F 85-95 Shore D 4K to +250°F /de/tds/ep30lte-2
EP30LTE-LO Two Part Epoxy Compound
EP30LTE-LO
Two component, low viscosity epoxy for bonding, sealing, coating and encapsulating
Coefficient of Thermal Expansion
15-18 X 10⁻⁶ in/in/°C
Dielectric Constant
4.5
  • MIL-STD-810G for Fungus Resistance
  • NASA Low Outgassing
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
  • Potting
Part A: 35,000-70,000 cps, Part B: 290-500 cps 75°F 48-72 hours, 200°F 2-3 hours, Optimum cure: Overnight at 75°F followed by 4-8 hours at 150°F to 200°F 85-95 Shore D 4K to +250°F /de/tds/ep30lte-lo
EP30LTE-LO Two Component Epoxy
EP30LTE-LO Black
Two component epoxy for bonding, sealing, coating and encapsulating featuring a very low coefficient of thermal expansion
Coefficient of Thermal Expansion
15-18 X 10⁻⁶ in/in/°C
Dielectric Constant
4.5
  • NASA Low Outgassing
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
  • Potting
Overnight at 75°F followed by 4-8 hours at 150°F to 200°F 85-95 Shore D 4K to +250°F /de/tds/ep30lte-lo-black
EP30M4 Two Part Epoxy
EP30M4
Two component epoxy system for high performance applications
Coefficient of Thermal Expansion
45-50 x 10⁻⁶ in/in/°C
Volume Resistivity
>10¹⁴ ohm-cm
  • 1,000 Hours at 85°C/85% RH
  • RoHS Compliant
  • Bonding
  • Sealing
  • Encapsulation
  • Coating
  • Gap Filling
Part A: 55,000-110,000 cps, Part B: 350-700 cps overnight at 75°F followed by a few hours at 150-200°F 80-90 Shore D -80°F to +300°F /de/tds/ep30m4
EP30M4LV Two Part Epoxy System
EP30M4LV
Two component epoxy system for high performance applications
Coefficient of Thermal Expansion
45-50 x 10⁻⁶ in/in/°C
Volume Resistivity
>10¹⁴ ohm-cm
  • RoHS Compliant
  • Bonding
  • Sealing
  • Encapsulation
  • Coating
  • Gap Filling
Part A: 350-700 cps, Part B: 10,000-16,000 cps overnight at 75°F followed by 2-4 hours at 150-200°F 80-90 Shore D -80°F to +250°F /de/tds/ep30m4lv
EP30Med Two Part Epoxy
EP30Med
Low viscosity, two component epoxy system
Dielectric Strength
440 volts/mil
Tensile Modulus
300,000-350,000 psi
  • FDA Food Grade 21 CFR 175.105
  • ISO 10993-5 for Cytotoxicity
  • RoHS Compliant
  • USP Class VI Medical
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 900-1,500 cps, Part B: 280-500 cps overnight at 75°F, followed by 1-2 hours at 150-200°F 75-85 Shore D -60°F to +250°F /de/tds/ep30med
EP30ND Two Part Epoxy
EP30ND
Two component, epoxy system for bonding, sealing and coating
Coefficient of Thermal Expansion
45-50 in/in X 10⁻⁶/°C
Dielectric Strength
450 volts/mil
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: paste, Part B: 250-500 cps overnight at 75°F followed by 2-3 hours at 150-200°F 80-90 Shore D -60°F to +300°F /de/tds/ep30nd
EP30NS Two Part Epoxy
EP30NS
Two part, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation
Coefficient of Thermal Expansion
25-30 X 10⁻⁶ in/in/°C
Refractive Index
1.56
  • ASTM D4060-14 for Abrasion Resistance
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
30,000-60,000 cps overnight at 75°F, followed by 2-3 hours at 150-200°F 80-90 Shore D -60°F to +300°F /de/tds/ep30ns

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