Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP46HT-2ND2 Two part, non-drip epoxy for bonding, sealing, coating and casting Glass Transition Temperature (Tg) 155-165°C Tensile Modulus 400,000-450,000 psi	RoHS Compliant	Bonding Sealing Coating	paste	250-300°F: 3-4 hours; post cure, 350-400°F: 2-3 hours	80-90 Shore D	-100°F to +500°F	/de/tds/ep46ht-2nd2
EP48TC Two part epoxy adhesive with ultra low thermal resistance properties meets NASA low outgassing requirements Coefficient of Thermal Expansion 13-15 X 10⁻⁶ in/in/°C Dielectric Constant 4.7 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-100°F to +300°F	/de/tds/ep48tc
EP4CL-80 One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C Glass Transition Temperature (Tg) 155-160°C Refractive Index 1.52	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Underfill	50-150 cps	60-90 minutes at 80-85°C or 10-15 minutes at 100°C	85-95 Shore D	'-80°F to +450°F (-80°F to +450°F)	/de/tds/ep4cl-80
EP4CL-80Med One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications Glass Transition Temperature (Tg) 155-160°C Refractive Index 1.52	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Impregnation Underfill	50-150 cps	60-90 minutes at 80-85°C or 10-15 minutes at 100°C	85-95 Shore D	'-80°F to +450°F (-80°F to +450°F)	/de/tds/ep4cl-80med
EP4G-80 One component, graphite filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 130-140°C Volume Resistivity 50-100 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-10,000 cps	60-90 minutes at 80°C	75-85 Shore D	-58°F to +347°F	/de/tds/ep4g-80
EP4G-80Med One component, medical grade, graphite filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 130-140°C Volume Resistivity 50-100 ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating	4,000-10,000 cps	60-90 minutes at 80°C	75-85 Shore D	-58°F to +347°F	/de/tds/ep4g-80med
EP4NS-80 One component, optically clear nanosilica filled epoxy for bonding and sealing with curing temperature of 80°C to 85°C. Meets NASA low outgassing. Refractive Index 1.52 Tensile Modulus >1,000,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Impregnation Underfill	250-750 cps	2-4 hours at 80°C followed by 1-2 hours at 110-125°C	85-95 Shore D	-80°F to +450°F	/de/tds/ep4ns-80
EP4S-80 One component, silver filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 110-120°C Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	10,000-15,000 cps	60-90 minutes at 80°C	75-85 Shore D	-76°F to +302°F	/de/tds/ep4s-80
EP4TC-80 One component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 120-125°C Thermal Conductivity 11-15 BTU•in/(ft²•hr•°F) [1.6-2.2 W/(m•K)]	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating	300,000-800,000 cps	80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C	85-95 Shore D	-58°F to +347°F	/de/tds/ep4tc-80
EP4UF-80 One component epoxy for bonding and underfill applications, minimum curing temperature 80°C Glass Transition Temperature (Tg) 150-155°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant NASA Low Outgassing	Bonding Underfill Sealing Coating	500-1,500 cps	30-60 minutes at 80-85°C, or 15-30 minutes at 90-95°C	85-95 Shore D	-58°F to +302°F	/de/tds/ep4uf-80

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