Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
Supreme 3DM-85 One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation Tensile Strength 2,000-3,000 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Gap Filling	35,000-95,000 cps	Cures at 185°F for 2 to 3 hours	75-85 Shore D	-100°F to +350°F	/de/tds/supreme-3dm-85
Supreme 3HT One component, toughened epoxy adhesive, sealant and coating Dielectric Constant 3.9 Tensile Lap Shear Strength 1,600-1,800 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	100,000-200,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes	80-90 Shore D	-100°F to +350°F	/de/tds/supreme-3ht
Supreme 3HTND-2CCM One component, toughened epoxy system for bonding, sealing, coating and encapsulating Glass Transition Temperature (Tg) 90°C Tensile Modulus 250,000-300,000 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling	paste	250°F for 20-30 minutes or 300°F for 5-10 minutes	80-90 Shore D	-100°F to +400°F	/de/tds/supreme-3htnd-2ccm
Supreme 3HTND-2DA One component, toughened, electrically insulating epoxy for die attach applications Coefficient of Thermal Expansion 25-30 X 10⁻⁶ in/in/°C Dielectric Constant 4.5	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Die Attach	>300,000 cps	5-10 minutes at 150°C	>70 Shore D	-100°F to +400°F	/de/tds/supreme-3htnd-2da
Supreme 3HTND-2DM-1 One component epoxy featuring non drip consistency for bonding, sealing and specialty dam-and-fill encapsulation Dielectric Constant 4.6 @ 75°F, 60 Hz Tensile Modulus 300,000-350,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling	paste	20-30 minutes at 250°F or 5-10 minutes at 300°F	80-90 Shore D	-100°F to +400°F	/de/tds/supreme-3htnd-2dm-1
Supreme 3HTS-80 One component, toughened, silver conductive epoxy system Tensile Lap Shear Strength 400-500 psi Volume Resistivity <0.05 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Cures at 175°F to 185°F for 2 to 3 hours	50-60 Shore D	-100°F to +350°F	/de/tds/supreme-3hts-80
Supreme 42HT-2 Two component epoxy system for bonding, sealing, coating and encapsulation Dielectric Strength 440 volts/mil Glass Transition Temperature (Tg) 130-135°C	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling Potting Casting	Part A: 75,000-125,000 cps, Part B: 30-70 cps	48-72 hours at 75°F; 2-3 hours at 200°F; overnight at 75°F followed by 3-5 hours at 160-200°F	70-80 Shore D	-80°F to +450°F	/de/tds/supreme-42ht-2
Supreme 42HT-2ND Two component epoxy system for bonding, sealing and coating Glass Transition Temperature (Tg) 130-135°C Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 3-5 hours at 160-200°F	75-85 Shore D	-80°F to +450°F	/de/tds/supreme-42ht-2nd
Supreme 42HT-2ND Black Two component, non-flow epoxy system for bonding, sealing and coating Dielectric Constant 4.5 Glass Transition Temperature (Tg) 130-135 °C	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	48-72 hours at ambient temperatures and in 2-3 hours at 200°F; optimum cure schedule is overnight at 75°F followed by 3-5 hours at 160-200°F	75-85 Shore D	4K to +450°F	/de/tds/supreme-42ht-2nd-black
Supreme 42HT-2ND-2 Two component epoxy system for bonding, sealing and coating Glass Transition Temperature (Tg) 130-135°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	48-72 hours at ambient temperatures and in 2-3 hours at 200°F	70-80 Shore D	-80°F to +450°F	/de/tds/supreme-42ht-2nd-2

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