EP21AOHT

Master Bond EP21AOHT is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating combining an excellent performance profile, user friendly processing along with higher temperature resistance properties. It is very easy to use with a forgiving one to one mix ratio by weight or volume. It cures at ambient temperatures or more rapidly at elevated temperatures with the optimum schedule being overnight at room temperature followed by a few hours at 150-200°F. Its most outstanding feature is its superior thermal conductivity while sustaining ample electrical insulation values. EP21AOHT adheres well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It offers sound chemical resistance versus water, oil and fuels. Other desirable properties include minimal shrinkage upon curing, a low coefficient of thermal expansion, standout dimensional stability, first rate compressive strength and a high modulus of elasticity. Another positive is the service temperature range of -60°F to +400°F. The color of Part A is gray and Part B is off white. EP21AOHT has a broad combination of properties where top notch heat transfer and solid electrical insulation properties along with the other attributes mentioned above are needed, particularly in aerospace, electronic and specialty OEM type applications.

Product Advantages

• Convenient mixing: non-critical one to one mix ratio by weight or volume; smooth consistency
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required
• High bonding strength to a wide variety of substrates
• Low coefficient of expansion, very little shrinkage, superb dimensional stability
• Outstanding thermal conductivity
• Excellent electrical insulation properties