EP51AO
Two component, epoxy adhesive, sealant and coating compound
Key Features
- Superior dimensional stability
- Easy handling
- Thermally conductive
- Very rapid curing
- Cryogenically serviceable
- Suitable for bonding, sealing and coating
Typical Properties
Viscosity
Part A: 50,000-100,000 cps, Part B: 75,000-125,000 cps
Cure Schedule
75°F: 12-24 hours, 200°F: 1 hour
Hardness
>75 Shore D
Service Temperature Range
4K to +250°F
Coefficient of Thermal Expansion
25-30 x 10⁻⁶ in/in/°C
Dielectric Strength
>400 volts/mil
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