News Releases

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore…

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications. It is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against…

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an…

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI…

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft² •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler…