News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards Release Date: 04/11/2022 Product: EP4G-80Med Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore… Read More...
	Thermally Conductive Epoxy Features Chemical and High Temperature Resistance Release Date: 03/09/2022 Product: EP35AOLV Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications. It is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against… Read More...
	UL Certified Epoxy Encapsulant Resists Arcing Without Igniting Release Date: 01/31/2022 Product: EP21AC Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an… Read More...
	Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding Release Date: 01/04/2022 Product: EP4S-80 Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI… Read More...
	Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy Release Date: 12/09/2021 Product: EP40TC Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft² •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler… Read More...