EP3RR-80
One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher
Key Features
- Exceptional dimensional stability
- Thermally conductive & electrically insulating
- Passes NASA low outgassing specifications
- Withstands 1,000 hours 85°C/85% RH
Typical Properties
Viscosity
60,000-120,000 cps
Cure Schedule
Cure in 45-50 minutes at 175-180°F, or in 25-30 minutes 250°F
Hardness
80-90 Shore D
Service Temperature Range
-100°F to +350°F
Dielectric Constant
4.4
Volume Resistivity
10¹⁴ ohm-cm
Imagen
