EP21AOND

Master Bond EP21AOND is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with an excellent performance profile and easy handling. It has a forgiving one to one mix ratio by weight or volume along with a paste consistency. It cures at ambient temperatures or more rapidly at elevated temperatures with the optimum schedule being overnight at room temperature followed by a few hours at 150-200°F. Most importantly, it is an excellent thermal conductor yet maintains superior electrical insulation values. EP21AOND will bond well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It has good bond strength along with effective chemical resistance versus water, oil and fuels. Some other outstanding features include little shrinkage upon curing, a low coefficient of thermal expansion, top notch dimensional stability, high compressive strength and a hefty modulus of elasticity. The service temperature range is -60°F to +250°F. The color of Part A is gray and Part B is off-white. The robust combination of properties especially its fine heat conductivity and highly reliable electrical insulation properties are particularly desirable in many aerospace, electronic and specialty OEM applications.

Product Advantages

• Convenient mixing: non-critical one to one mix ratio by weight or volume; paste consistency
• Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required
• High bonding strength to a wide variety of substrates
• Low coefficient of expansion, minimal shrinkage upon curing, superb dimensional stability
• First rate thermal conductivity
• Highly dependable electrical insulation properties