EP3HTSDA-2

Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. It is not premixed and frozen and has an unlimited working life at room temperature. For storage, simple refrigeration is fine. As mentioned above, it cures quickly at 250-300°F. EP3HTSDA-2 dispenses smoothly and easily.

In using it as an adhesive, it bonds well to many metals, ceramics, plastics, silicon dies and a wide variety of other substrates. It has superior physical strength properties including relatively high tensile lap shear strength. The unique attributes of EP3HTSDA-2 centers around its combination of extremely low volume resistivity and astoundingly high thermal conductivity (see below). Also, the filler particles used in this epoxy are exceptionally small (average 2-3 microns, largest less than 20), allowing for ultra thin bond lines. Ultimately, the key property of EP3HTSDA-2 is its incomparably low thermal resistance of 2-3 x 10^-6 K•m²/W.

The temperature range extends from -80°F to +450°F. Most importantly, it passes NASA low outgassing specifications. The extraordinary combination of easy handing, convenient storage, superlative thermal conductivity and phenomenally low thermal resistance make it a must go-to material in applications where high heat transfer is required and electrical conductivity is not an issue.

Product Advantages

• Single component system; no mixing needed
• Not premixed and frozen; unlimited working life at room temperature
• Highly electrically conductive
• Beyond impressive thermal conductivity
• Incredibly low thermal resistance
• NASA low outgassing
• Available in syringes that are compatible with automatic or manual dispensing equipment