Supreme 3DM-85

Master Bond Supreme 3DM-85 is a toughened, one part epoxy that can be used for bonding, sealing, and dam-and-fill applications. It is a no mix system with a curing schedule of 185°F for 2 to 3 hours. Aside from its use as an adhesive, it is also used for chip on board encapsulations. After curing, it blocks the flow of a second epoxy that is encapsulating chips and wire bonds. The curing temperature of 185°F is especially significant because it allows the epoxy to be used in applications where plastic substrates are sensitive to higher temperature curing profiles. This system is not premixed and frozen and its working life is unlimited at room temperature.

Supreme 3DM-85 bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. It has very good physical strength properties. The system is thermally conductive and electrically insulating. Also, it is a toughened system that can withstand various types of thermal cycling. The service temperature range is -100°F to +350°F. The color is black. While it is primarily used as a damming epoxy it can also be used for conventional bonding. Supreme 3DM-85 can be used for applications where a non-mixed epoxy is desirable and heat curing above 200°F is not possible.

Product Advantages

• One part system, no mixing needed
• Will not cure without heating
• Thermally conductive, electrically isolating
• Paste consistency, but easy to dispense from a syringe