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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP42HT-4AOMed Black Two part, thermally conductive epoxy for medical device manufacturing Coefficient of Thermal Expansion 18-21 x 10⁻⁶ in/in/°C Tensile Modulus 500,000-550,000 psi	RoHS Compliant USP Class VI Medical ISO 10993-5 for Cytotoxicity 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Casting Encapsulation Gap Filling Potting	Part A: 50,000-120,000 cps, Part B: 200-1,000 cps	overnight at 75°F, followed by 2-3 hours at 150-200°F	85-90 Shore D	4K to +400°F	/es/tds/ep42ht-4aomed-black
EP45HT Two component epoxy system for bonding, sealing, coating and encapsulation Glass Transition Temperature (Tg) 150-160°C Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Casting Encapsulation Gap Filling	Part A: 60,000-110,000 cps, Part B: 500-2,500 cps	250°F for 3-4 hours or 300°F for 2-3 hours	75-85 Shore D	-80°F to +500°F	/es/tds/ep45ht
EP45HTMed Two component, high temperature resistant, medical grade epoxy resists repeated sterilizations Glass Transition Temperature (Tg) 150-160°C Volume Resistivity >10¹⁴ ohm-cm	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Casting Encapsulation Gap Filling Potting	50,000-60,000 cps	250°F for 3-4 hours or 300°F for 2-3 hours	75-85 Shore D	-80°F to 500°F	/es/tds/ep45htmed
EP45HTND-2 Two component epoxy system for high performance bonding, sealing and coating Dielectric Constant 4.3 Glass Transition Temperature (Tg) 150-160°C	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: paste, Part B: paste	3-4 hours at 250°F or 2-3 hours at 300°F	75-85 Shore D	-80°F to +500°F	/tds/ep45htnd-2
EP46HT Two component, heat resistant epoxy system for bonding and sealing Dielectric Strength 450 volts/mil Glass Transition Temperature (Tg) 175°C	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	3,000-6,000 cps	250-300°F for 3-4 hours	>80 Shore D	-80°F to +500°F	/es/tds/ep46ht
EP46HT-1 Two component epoxy for structural bonding featuring superlative heat resistance; requires oven curing Dielectric Strength 450 volts/mil Glass Transition Temperature (Tg) 230-240°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	15,000-35,000 cps	250-300°F for 2-3 hours, followed by a post cure for optimum properties at 350-400°F for 2 hours	80-90 Shore D	-100°F to +600°F	/es/tds/ep46ht-1
EP46HT-1ND-2 Two component epoxy paste for structural bonding featuring superlative heat resistance; requires oven curing. Will not flow during processing Dielectric Strength 450 volts/mil Tensile Lap Shear Strength >2,200 psi	RoHS Compliant	Bonding Sealing Gap Filling Coating	paste	250-300°F for 2-3 hours, followed by a post cure for optimum properties at 350-400°F for 2 hours	80-90 Shore D	-100°F to +600°F	/es/tds/ep46ht-1nd-2
EP46HT-2 Two part high performance epoxy for bonding, sealing, coating and casting Dielectric Strength 450 volts/mil Glass Transition Temperature (Tg) 155-165°C	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Casting	12,000-20,000 cps	250-300°F, 3-4 hours	80-90 Shore D	-100°F to +500°F	/es/tds/ep46ht-2
EP46HT-2AO Black Two part high performance epoxy for bonding, sealing and encapsulation Dielectric Strength 450 volts/mil Volume Resistivity >10¹⁴ ohm-cm	MIL-STD-810G for Fungus Resistance NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Coating Casting Potting Gap Filling	140,000-280,000 cps	3-4 hours at 250-300°F followed by a post cure of 2-3 hours at 350-400°F	85-90 Shore D	-100°F to +500°F	/es/tds/ep46ht-2ao-black
EP46HT-2Med Two component, heat resistant, medical grade epoxy Dielectric Strength 450 volts/mil Tensile Strength 10,000-11,000 psi	USP Class VI Medical RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	12,000-20,000 cps	250-300°F for 3-4 hours, followed by 350-400°F for 2-3 hours	80-90 Shore D	-100°F to +500°F	/es/tds/ep46ht-2med

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