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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP50-1.5 Two component, ultra fast setting epoxy system for bonding and sealing Tensile Modulus >350,000 psi Volume Resistivity 10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 10,000-16,000 cps, Part B: 50,000-75,000 cps	75°F 6-12 hours	>70 Shore D	4K to +250°F	/es/tds/ep50-15
EP51 Fast setting, two component epoxy for bonding and sealing Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 10,000-16,000 cps, Part B: 50,000-75,000 cps	75°F: 12-18 hours; 150°F: 30-60 minutes	>70 Shore D	4K to +250°F	/es/tds/ep51
EP51AO Two component, epoxy adhesive, sealant and coating compound Coefficient of Thermal Expansion 25-30 x 10⁻⁶ in/in/°C Dielectric Strength >400 volts/mil	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 50,000-100,000 cps, Part B: 75,000-125,000 cps	75°F: 12-24 hours, 200°F: 1 hour	>75 Shore D	4K to +250°F	/es/tds/ep51ao
EP53TC Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding, sealing, coating, and potting Acoustical Impedance 8.5 MRayl Thermal Conductivity 16-18 BTU•in/(ft²•hr•°F) [2.31-2.60 W/(m•K)]	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	45,000-65,000 cps	Cures at 80°C for 2 hours followed by 2-4 hours at 90-125°C.	85-95 Shore D	-100°F to +300°F	/es/tds/ep53tc
EP54TC Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing Dielectric Constant 4.7 Thermal Conductivity 41.6-45.1 BTU•in/(ft²•hr•°F) [6.0-6.5 W/(m•K)]	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Gap Filling	100,000-200,000 cps	80°C for 2 hours followed by 2-4 hours at 90-125°C. An alternative cure schedule would be 4-6 hours at 80-90°C.	85-95 Shore D	-100°F to +400°F	/es/tds/ep54tc
EP55TCFL One component epoxy for bonding and underfill applications, minimum curing temperature 80°C Dielectric Constant 4.4 Thermal Conductivity 3.2-3.8 W/(m•K)	RoHS Compliant NASA Low Outgassing	Bonding Casting Encapsulation Potting Sealing Coating Gap Filling	30,000-60,000 cps	50-70°C 4-6 hours; 80-90°C 3-4 hours	55-65 Shore D	-58°F to +257°F	/es/tds/ep55tcfl
EP5LTE-100 One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C Coefficient of Thermal Expansion 8-12 x 10⁻⁶ in/in/°C Glass Transition Temperature (Tg) 120-125°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	20,000-160,000 cps	90-120 minutes at 100°C followed by 2-3 hours at 100-125°C	85-95 Shore D	-76°F to +347°F	/es/tds/ep5lte-100
EP62-1 Two component epoxy resin system featuring excellent temperature and chemical resistance Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	4,000-8,000 cps	4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10-20 minutes at 125°C	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1
EP62-1AO Two component epoxy resin system featuring excellent temperature and chemical resistance Dielectric Constant 4.8 Tensile Lap Shear Strength 800-1,000 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	4-6 hours at 140-160°F, 20-40 minutes at 175-200°F or 10-20 minutes at 250-300°F	80-90 Shore D	-60°F to +450°F	/es/tds/ep62-1ao
EP62-1BF Two component, lower viscosity epoxy system featuring superior chemical resistance Dielectric Constant 4.2 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling Coating	2,000-5,000 cps	6-8 hours at 140-158°F [60-70°C], 60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]	80-90 Shore D	-60°F to +400°F	/es/tds/ep62-1bf

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