Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP110F8-5 Two component, high performance epoxy for potting, sealing, encapsulating and casting Coefficient of Thermal Expansion 60-70 in/in X 10⁻⁶/°C Tensile Modulus 35,000-65,000 psi	NASA Low Outgassing RoHS Compliant	Potting Sealing Encapsulation Coating Bonding Gap Filling	7,000-11,000 cps	4-6 hours at 250-300°F	70-80 Shore D	-100°F to +300°F	/es/tds/ep110f8-5
EP112 Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Refractive Index 1.55 Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Impregnation Gap Filling	50-200 cps	1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F	75-90 Shore D	-60°F to +450°F	/es/tds/ep112
EP121CL-LO Two component epoxy for potting, encapsulation, coating and sealing applications Dielectric Constant 3.25 Refractive Index 1.56	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Potting Encapsulation Sealing Coating Bonding	1,000-3,000 cps	2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F	80-90 Shore D	-80°F to +500°F	/es/tds/ep121cl-lo
EP125 Two part epoxy for bonding and sealing featuring very high temperature resistance Dielectric Constant 3.9 Tensile Lap Shear Strength 2,500-2,700 psi	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	250,000-500,000 cps	3-4 hours at 300°F or 2-3 hours at 350°F	85-95 Shore D	-80°F to +600°F	/es/tds/ep125
EP126 Two part epoxy for bonding and sealing featuring very high temperature resistance Dissipation Factor 0.091 @ 75F; 0.034 @ 500F Glass Transition Temperature (Tg) 160 to 180°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	250,000-500,000 cps	3-4 hours at 300°F or 2-3 hours at 350°F		-80°F to +600°F	/es/tds/ep126
EP126TK Two part non-drip epoxy for bonding and sealing featuring very high temperature resistance Dielectric Constant 3.9 Glass Transition Temperature (Tg) 160 to 180°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	3-4 hours at 300°F or 2-3 hours at 350°F; post curing for 12-24 hours at 400-450°F		-80°F to +600°F	/es/tds/ep126tk
EP13 One component, heat curing epoxy for structural bonding applications Dielectric Constant 4.5 Tensile Lap Shear Strength 3,500 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	60-90 minutes at 300-350°F	80-85 Shore D	-60°F to +500°F	/es/tds/ep13
EP132 Two part epoxy for bonding featuring convenient processing and high temperature resistance Dielectric Constant 3.29 Glass Transition Temperature (Tg) 205-210°C	RoHS Compliant	Bonding Sealing Coating Gap Filling	25,000-45,000 cps	2 hours at 125°C followed by 3 hours at 150°C; post cure of 3-4 hours at 350°F	80-90 Shore D	-60°F to +550°F	/es/tds/ep132
EP13LTE One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion Coefficient of Thermal Expansion 15-20 X 10⁻⁶ in/in/°C Glass Transition Temperature (Tg) 155-160°C	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling	paste	300-350°F for 1-2 hours; post cure of 2-3 hours at 350-400°F	85-95 Shore D	-60°F to +500°F	/es/tds/ep13lte
EP13SPND-2 One component, heat curing epoxy for structural bonding applications Dielectric Constant 4.9 Tensile Lap Shear Strength 3,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Gap Filling	paste	300-350°F for 60-90 minutes, post cure at 350-400°F for 2 hours	85-90 Shore D	-60°F to +500°F	/tds/ep13spnd-2

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