EP112
Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Key Features
- Very low viscosity
- Superior electrical insulation heat resistance
- Excellent optical clarity
- Withstands 1,000 hours 85°C/85% RH
Typical Properties
Viscosity
50-200 cps
Cure Schedule
1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F
Hardness
75-90 Shore D
Service Temperature Range
-60°F to +450°F
Refractive Index
1.55
Volume Resistivity
>10¹⁴ ohm-cm
Imagen

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Applications
Certifications
1,000 Hours at 85°C/85% RH
Meets EU Directive 2015/863
Case Study
EP112: Utilized to Bond Silicon Wafers to Glass Support Substrates during Microelectronics Fabrication
Master Bond EP112 is an ultra-low-viscosity, electrically insulating, two-component epoxy system ideal for various applications. This two-part case study series presents two use cases for EP112 for microelectronics fabrication processes when used to …