EP21ND-LO
Two component, non-drip epoxy system for bonding, sealing and coating applications
Key Features
- Convenient one to one mix ratio
- Cures at ambient temperatures
- Passes NASA low outgassing specifications
- Paste — non-drip application
- High bond strength
- Dimensionally stable
Typical Properties
Viscosity
paste
Cure Schedule
12-24 hours at 75°F, plus another 2 hours at 150-200°F
Hardness
>70 Shore D
Service Temperature Range
-60°F to +250°F
Dielectric Constant
2.92 at 75°F, 60 Hz
Tensile Lap Shear Strength
>2,500 psi at 75°F
Imagen
