EP51FL-1ND-2

Master Bond EP51FL-1ND-2 is a two component, highly flexible epoxy resin system for high performance bonding, sealing and coating featuring a very rapid set up time and cure. Most flexibilized epoxy formulations are slower curing, but EP51FL-1ND-2 cures much more quickly. It typically has a set up time of 30-40 minutes and full cure within 24 hours at room temperature. Another alternative cure schedule is 2-3 hours at room temperature followed by an hour at 150-200°F. It has a one to three mix ratio by weight or by volume. Some of the outstanding properties of this system are exceptionally high peel strength and elongation. Its excellent flexibility allows it to be used in applications involving thermal cycling, harsh thermal and mechanical shocks and other situations where superior toughness is desirable. EP51FL-1ND-2 bonds well to many different substrates including metals, plastics and many types of rubber. In fact, it may adhere well to untreated rubber materials such as neoprene, nitrile, SBR and occasionally EPDM rubber compounds; materials that normally require time consuming surface preparation. It has very good chemical resistance to oils, fuels and water. EP51FL-1ND-2 is a first class electrical insulator. Its service temperature range is -100°F to +250°F with superior low temperature serviceability. EP51FL-1ND-2 is widely used in the aerospace, electronic, electrical, repair and maintenance and specialty OEM industries where good flexibility and fast cure are desirable property traits.

Product Advantages

• Non-critical 1:3 mix ratio by weight or volume
• Paste consistency
• Fast curing
• High peel strength and elongation
• Resists thermal cycling and mechanical shock
• Superior adhesion to a wide variety of substrates